Event - Close-up*

kinseyja@mail.uc.edu

Mechanical Engineering

Class of 2026

Co-ops: Emerson Climate Technologies/Copeland, GE Aerospace, Crown Equipment

sieberrc@mail.uc.edu

Computer Engineering

Class of 2026

Co-ops: Idaho National Laboratory, HII Mission Technologies

fisheby@mail.uc.edu

Mechanical Engineering

Class of 2027

Co-ops: Altec Industries

nazzalsm@mail.uc.edu

Chemical Engineering

Class of 2028

Co-ops: SABIC

lewis3ap@mail.uc.edu

Aerospace Engineering

Class of 2028

Co-ops: PCC Airfoils

watsonev@mail.uc.edu

Computer Engineering

Class of 2028

Co-ops: Scram Systems, London Computer Systems

veluvosa@mail.uc.edu

Biomedical Engineering

Class of 2028

Co-ops: Atricure

marti3r7@mail.uc.edu

Electrical Engineering

Class of 2026

Co-ops: Midmark Corporation

patel9ps@mail.uc.edu

Computer Science

Class of 2030

mistryvj@mail.uc.edu

Architectural Engineering

Class of 2030

Mccrayei@mail.uc.edu

Mechanical Engineering Technology

Class of 2028

Co-ops: AtriCure Inc. & Thaman Rubber Co.