Event - Close-up*

vailey@mail.uc.edu

Mechanical Engineering

Class of 2026

Co-ops: DMC Inc., Nylok LLC, Honda, Swagelok

Green2e2@mail.uc.edu

Aerospace Engineering

Class of 2027

Co-ops: Schaeffler Group

kim4h7@mail.uc.edu

Chemical engineering

Class of 2026

Co-ops: Idaho National Laboratory, Zeon Chemicals

mcintila@mail.uc.edu

Electrical Engineering

Class of 2027

Co-ops: Intel, Matrix Technologies, Lincoln Electric

Turne3a4@mail.uc.edu

Mechanical Engineering

Class of 2028

Co-ops: Beckett Thermal Solutions

shimkoea@mail.uc.edu

Biomedical Engineering

Class of 2027

Co-ops: Cook Medical, Haag-Streit USA

anilkuai@mail.uc.edu

Industrial and Systems Engineering

Class of 2029

Co-ops: Festo Corp.

venkasn@mail.uc.edu

Cybersecurity Engineering

Class of 2030

sullisg@mail.uc.edu

Chemical Engineering

Class of 2030