Meeting - 5th General Body Meeting

Wed Oct 31 2018 17:00:00 - Wed Oct 31 2018 18:00:00 at 405 ERC

Description

5th General Body Meeting

Attendees

Kurt Lewis

lewis2ku@mail.uc.edu

Computer Science

Class of 2019

Co-ops: Siemens PLM Software, Etegent Technologies, GE Digital

Sean Kane

kanesp@mail.uc.edu

Electrical Engineering

Class of 2020

Co-ops: Idaho National Laboratory, Duke Energy

Ryan Muir

muirrj@mail.uc.edu

Chemical Engineering

Class of 2019

Co-ops: BASF

Christian Gastaldo

gastalcg@mail.uc.edu

Biomedical Engineering

Class of 2021

Co-ops: Zimmer Biomet

Hannah Carson

carsonhr@mail.uc.edu

Chemical Engineering

Class of 2019

Co-ops: AstraZeneca, Kellogg's, Amgen

Emma Lowe

loweea@mail.uc.edu

Chemical Engineering

Class of 2019

Co-ops: BASF & Marathon Petroleum Corporation

Tessa Wiedmann

wiedmatn@mail.uc.edu

Computer Science

Class of 2019

Co-ops: Microsoft, Code.org, TutorGen Inc., Siemens PLM Software

Sean Weddell

weddelsp@mail.uc.edu

Chemical Engineering

Class of 2020

Co-ops: The Dow Chemical Company

Mitchell Muha

muhamj@mail.uc.edu

Chemical Engineering

Class of 2019

Co-ops: The Lubrizol Corporation

Max Goetz

goetzjo@mail.uc.edu

Mechanical Engineering

Class of 2021

Co-ops: Clarke Fire Protection

Becky Rice

ricer4@mail.uc.edu

Mechanical Engineering

Class of 2021

Christopher Stone

stonec5@mail.uc.edu

Chemical Engineering

Class of 2019

Co-ops: Procter and Gamble

Sydney O'Connor

oconnosy@mail.uc.edu

Computer Engineering

Class of 2021

Co-ops: L3 Technologies

Gabrielle Notorgiacomo

notorgga@mail.uc.edu

Biomedical Engineering

Class of 2019

Co-ops: Intelemage, Eccrine Systems Inc

Alexander Rodrigues

rodrigax@mail.uc.edu

Architectural Engineering

Class of 2020

Co-ops: BHDP, CMTA, Atelier 10

Addison Gepfert

gepferap@mail.uc.edu

Biomedical Engineering

Class of 2021

Co-ops: Zimmer Biomet

Brian Allen

allen2b5@mail.uc.edu

Civil Engineering

Class of 2021

Co-ops: Contech Engineered Solutions LLC

Beth Palmer

palmerbh@mail.uc.edu

Biomedical Engineering

Class of 2019

Co-ops: Kinetic Vision, Siemens PLM Software, Bauerfeind AG

Samuel Carper

carpersl@mail.uc.edu

Civil Engineering

Class of 2021

Co-ops: Baker Concrete Construction

Caleb van Haaren

vanhaacf@mail.uc.edu

Computer Engineering

Class of 2019

Co-ops: Siemens PLM, UC Research, International Co-op Program

Megan Miller

mille5mn@mail.uc.edu

Architectural Engineering

Class of 2019

Co-ops: Schaefer, Skanska

Jennifer Adamec

adamecjr@mail.uc.edu

Architectural Engineering

Class of 2020

Co-ops: KLH Engineers, Hixson

Alexis Conway

conwayal@mail.uc.edu

Aerospace Engineering

Class of 2019

Joey Cheff

cheffjd@mail.uc.edu

Mechanical Engineering

Class of 2021

Co-ops: Toyota

Megan Moyer

Moyermg@mail.uc.edu

Chemical Engineering

Class of 2021

Co-ops: L'Oreal, Kellogg's

Chelsea Ker

kerce@mail.uc.edu

Chemical Engineering

Class of 2022

Heidi Van Valkenburgh

vanvalhk@mail.uc.edu

Chemical Engineering

Class of 2019

Co-ops: BASF, Process Plus, and Case Western Reserve University

Sarah DePage

depagesa@mail.uc.edu

Biomedical Engineering

Class of 2020

Co-ops: McWane Ductile - Manufacturing and Mechanical engineering co-op.

Ilma Alfadila

alfadiia@mail.uc.edu

Chemical Engineering

Class of 2021

Co-ops: SABIC

John Lehman

Lehmanjh@mail.uc.edu

Chemical Engineering

Class of 2021

Co-ops: L'Oreal USA, ThermalTech Engineering

Michael Frederick

Fredermj@mail.uc.edu

Sarah Sloan

sloansk@mail.uc.edu

Katey Faber

Faberkr@mail.uc.edu

Electrical Engineering

Class of 2020

Co-ops: Honeywell Intelligrated

Lauren Leesman

leesmale@mail.uc.edu

Biomedical Engineering

Class of 2019

Co-ops: DePuy Synthes, Cincinnati Sub Zero