Meeting - 3rd General Body Meeting
Description
Attendees
lindsaln@mail.uc.edu
Computer Engineering
Class of 2021
Co-ops: London Computer Systems, Siemens PLM Software
carsonhr@mail.uc.edu
Chemical Engineering
Class of 2019
Co-ops: AstraZeneca, Kellogg's, Amgen
schalkcw@mail.uc.edu
Mechanical Engineering Technology
Class of 2021
Co-ops: KBA Architects, TECT Power
loweea@mail.uc.edu
Chemical Engineering
Class of 2019
Co-ops: BASF & Marathon Petroleum Corporation
wiedmatn@mail.uc.edu
Computer Science
Class of 2019
Co-ops: Microsoft, Code.org, TutorGen Inc., Siemens PLM Software
kohlsat@mail.uc.edu
Electrical Engineering
Class of 2020
Co-ops: Helix Electric, L3 Technologies
linstrjs@mail.uc.edu
notorgga@mail.uc.edu
Biomedical Engineering
Class of 2019
Co-ops: Intelemage, Eccrine Systems Inc
vanvalhk@mail.uc.edu
Chemical Engineering
Class of 2019
Co-ops: BASF, Process Plus, and Case Western Reserve University
jones2tw@mail.uc.edu
Mechanical Engineering
Class of 2019
Co-ops: KLH Engineers, Crowder Construction
madisek@mail.uc.edu
Biomedical Engineering
Class of 2019
Co-ops: UC Medical Center, SOL, Sheba Medical Center - Israel
leesmale@mail.uc.edu
Biomedical Engineering
Class of 2019
Co-ops: DePuy Synthes, Cincinnati Sub Zero
schneiem@mail.uc.edu
Mechanical Engineering
Class of 2020
Co-ops: 4 rotations at L’Oreal
weisshm@mail.uc.edu
Mechanical Engineering
Class of 2022
Co-ops: Cooper Tire and Rubber Company
Schroea7@mail.uc.edu
Chemical Engineering
Class of 2021
Co-ops: Thermo-Fisher Scientific (Greenville, NC)
campbeij@mail.uc.edu
Biomedical Engineering
Class of 2021
Co-ops: Cincinnati Children's Hospital, Eccrine Systems Inc.